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Business Profiles
patentbuddy: Nina Dambrowsky
FORSCHUNGSZENTRUM KARLSRUHE GMBH
Education
IEICE SEARCH SYSTEM
search.ieice.org
... Martin BORNER · Nina DAMBROWSKY · Jurgen MOHR Publication IEICE TRANSACTIONS on Electronics Vol.E90-C No.12 pp
Books & Literature
books.google.com › books › about › Goldgalvanik...Goldgalvanik in der Mikrosystemtechnik: Herausforderungen ...
books.google.de
Goldgalvanik in der Mikrosystemtechnik: Herausforderungen durch neue Anwendungen. Front Cover. Nina Dambrowsky, Joachim Schulz. FZKA,
Related Documents
Nina Dambrowsky - researchr alias
researchr.org
Publications by 'Nina Dambrowsky'. Publications; Advised. No publications in this list. About · Contact · Credits · Help · Web Service API · Blog · FAQ · Feedback.
ACU E Branch - PDF documents
www.documbase.com
Theoretical and practical aspects of thermo mechanical reliability in printed circuit boards with copper plated through holes stefan neumann, nina dambrowsky.
An Ultra-Deep High-Q Microwave Cavity Resonator Fabricated Using Deep...
researchr.org
... Sven Achenbach and Martin Börner and Nina Dambrowsky and Jürgen Mohr}, year = {2007}, doi = {http://dx.doi.org ietele/e90-c }, researchr ...
Filling through holes and blind microvias with copper using reverse...
www.deepdyve.com
Bernd Roelfs, Nina Dambrowsky, Christof Erben and Stephen Kenny. Atotech, Berlin, Germany. Abstract. Purpose – The purpose of this paper is to present a ...
Scientific Publications
Filling through holes and blind microvias with copper using rever...:...
www.ingentaconnect.com
Bernd Roelfs, Nina Dambrowsky, Christof Erben and Stephen Kenny. Atotech, Berlin, Germany. Abstract. Purpose – The purpose of this paper is to present a ...
Forschungsdatenbank Freiburg
forschdb.verwaltung.uni-freiburg.de
Dr. Jan Korvink, Zweitgutachter/in Prof. Dr. Holger Reinecke), Nina Dambrowsky: Goldgalvanik in der Mikrosystemtechnik (Erstgutachter/in Prof.
Publications
www.pubfacts.com › author › Volker+PiotterPublications Authored by Volker Piotter | PubFacts
www.pubfacts.com
Eric Gottwald Stefan Giselbrecht Caroline Augspurger Brigitte Lahni Nina Dambrowsky Roman Truckenmüller Volker Piotter Thomas Gietzelt Oliver Wendt ...
EmeraldInsight
www.emerald.com
Bernd Roelfs, Nina Dambrowsky, Christof Erben, Stephen Kenny (pp ) Keywords: Printed circuits, Electrical connections, Through hole filling, Laser drilling, Pulse reverse plating, Cu plating, Microvias
Reports & Statements
TAGUNGSBAND 7. EXPERTENWORKSHOP - DAS ANWENDERFORUM - PDF...
docplayer.org
Silber und Silberlegierungen Dr. Nina Dambrowsky, Siemens AG, Tribologische Eigenschaften von Silber- und Silberdispersionsschichten: Eine Frage der ...
Miscellaneous
Dr. Nina Dambrowsky | LinkedIn
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View Dr. Nina Dambrowsky's professional profile on LinkedIn. LinkedIn is the world's largest business network, helping professionals like Dr. Nina Dambrowsky ...
WO A3 - Verfahren zur herstellung einer schicht auf einem...
patents.google.com
Inventor Nina Dambrowsky Stefan Giselbrecht Roman Truckenmueller Original Assignee Karlsruhe Forschzent Nina Dambrowsky Stefan Giselbrecht Roman Truckenmueller
patents.google.com › patentEP A1 - Metal plating composition for deposition of tin ...
patents.google.com
Application number: EP A; Other languages: German (de) · French (fr); Inventor: Lukas Bedrnik: Heiko Brunner: Nina Dambrowsky: Vaclav Kriz; Current ...
WO A3 - Method for producing a layer on a moulding and use...
patents.google.com
The invention relates to a method for producing a preferably electrically conductive layer from a moulding by which very narrow interconnects or...
CRITERIA FOR PRELOADED BOLTS - PDF
docplayer.net
Theoretical and Practical Aspects of Thermo Mechanical Reliability in Printed Circuit Boards with Copper Plated Through Holes Stefan Neumann, Nina Dambrowsky, Stephen Kenny Atotech Deutschland GmbH Berlin,
FILLING THROUGH HOLES AND BLIND MICRO VIAS …
www.semanticscholar.org
FILLING THROUGH HOLES AND BLIND MICRO VIAS WITH COPPER USING REVERSE PULSE PLATING AND INSOLUBLE ANODES Bernd Roelfs Ph.D., Nina Dambrowsky Ph.D., Christof Erben, and Stephen Kenny
A chip-based platform for the in vitro generation of tissues in...
pubs.rsc.org
Eric Gottwald *a, Stefan Giselbrecht a, Caroline Augspurger b, Brigitte Lahni a, Nina Dambrowsky c, Roman Truckenmüller d, Volker Piotter e, ...
EP A1 - Metal plating composition for deposition of tin-zinc...
patents.google.com
Other languages: German: English: French; Inventor: Lukas Bedrnik: Heiko Brunner: Nina Dambrowsky: Vaclav Kriz; Current Assignee. The listed assignees ...
kundoc.com › pdf-time-evolution-of-stress-and-microstructure-in-elec...Time Evolution of Stress and Microstructure in Electroplated ...
coek.info
We thank Dr. Nina Dambrowsky for valuable suggestions. References [1] J.W. Dini, D.D. Snyder, Electrodeposition of Copper, in Modern ...
DFX - DFM for Flexible PCBs Jeremy Rygate - PDF Free Download
docplayer.net
... Mechanical Reliability in Printed Circuit Boards with Copper Plated Through Holes Stefan Neumann, Nina Dambrowsky, Stephen Kenny Atotech Deutschland ...
Direct nano-crystalline Ni plating on titanium surfaces - PDF
businessdocbox.com
Via Filling: Challenges for the Chemistry in the Plating Process Mike Palazzola Nina Dambrowsky and Stephen Kenny Atotech Deutschland GmbH, Germany ...
US A1 - Method for producing a layer on a molded article...
patents.google.com
A method for producing a layer on a molded article. The method includes providing a formable film. Galvanically catalytically active nuclei are anchored...
WO A3 - Procédé de production d'une couche sur un corps...
patents.google.com
L'invention concerne un procédé pour produire une couche, de préférence électroconductrice, sur un corps façonné, lequel procédé permet d'appliquer des...
Electrolytic Deposition of Fine Pitch Sn/Cu Solder Bumps for Flip...
docplayer.net
... [2] Dr. Nina Dambrowsky, Frank Hilbert, Sven Lamprecht, Kai-Jens Matejat and Dr. Bernd Roelfs The Smaller the Better - Simultaneous Electrolytic Solder ...
www.circuitinsight.com › programsVia Filling: Challenges in the Plating Process - Circuit Insight
www.circuitinsight.com
Nina Dambrowsky and Stephen Kenny Atotech Deutschland GmbH, Germany. Summary. Copper filling of laser drilled blind micro vias (BMV's) is now the ...
EP A1 - Metallplattierungszusammensetzung zur Beschichtung von...
patents.google.com
A tin-zinc alloy plating bath composition comprising a quaternary ammonium polymer additive. A process for deposition of tin-zinc alloys from a plating bath...
www.emerald.com › insight › content › doi › full › htmlFilling through holes and blind microvias with copper using ...
www.emerald.com
Dr Nina Dambrowsky is currently a scientist in special projects for electroplating applications in the Electronics Division of Atotech Germany in ...
New Challenges for Higher Aspect Ratio: Filling Through-holes and...
pcb.iconnect007.com
Mike would like to acknowledge his co authors and colleagues: Nina Dambrowsky, Christof Erben, Stephen Kenny, and Bernd Roelfs from ...
METHOD FOR DEPOSITING THICK COPPER LAYERS ONTO SINTERED MATERIALS -...
www.patentsencyclopedia.com
Inventors: Markus Gloeden (Berlin, DE) Herko Genth (Berlin, DE) Nina Dambrowsky (Berlin, DE) Anthony Mcnelly (Berlin, DE) Robert Ruether ...
Nina - Patent applications
www.patentsencyclopedia.com
Nina Dambrowsky, Berlin DE. Patent application number, Description, Published , METHOD FOR PRODUCING A LAYER ON A MOLDED ...
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